The model SE101 sensor die is designed for automotive application, and is operated on the piezoresistive effect. Manufactured by the 6″ silicone micro-machining process, this sensor die has silicon-on-silicon structure with dimensions of 1mm x 1mm x 0.3mm. Due to its unique design of the pressure diaphragm, the SE101 possesses not only high sensitivity but also extraordinary overload pressure (proof pressure and burst pressure).
As a non-singal-conditioning sensor die, the SE101 is available in an open-bridge circuit with 5 solder pads for both bridge adjustment and temperature compensation.
Before packing, each SE101 sensor die is individually tested and qualified to its specifications.
3 different types of packaging are available as options to fit different marketing demands.
proximity sensor